The board of Paras Defence and Space Technologies at its meeting held on 19 January 2026 has approved incorporation of a subsidiary named Paras Semiconductors.
The new subsidiary will be setting up State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing), with a focus on AI, High Performance Computing (HPC), Networking, and Data Center Applications.
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